AIP Wire Report, Washington DC.
The U.S. Department of State on February 19 announced a new initiative aimed at accelerating the deployment of secure, AI-ready smartphones across the Indo-Pacific, unveiling a competitive funding process of up to $200 million in foreign assistance.
The program seeks statements of interest from Mobile Network Operators (MNOs) and Original Equipment Manufacturers (OEMs) to support the distribution of affordable, high-quality smartphones operating on trusted American systems such as Android or iOS. The goal is to strengthen access to secure digital infrastructure while ensuring that emerging users across the Indo-Pacific are integrated into an open and innovation-driven software ecosystem.
According to the Department, the initiative forms part of a broader strategic vision described as “Pax Silica,” aimed at fostering a secure and interconnected regional technology environment. U.S. officials say the effort is intended to provide market-based alternatives to high-risk vendors and counter price distortions created by untrusted providers, while promoting trusted AI software systems.
Proposals must demonstrate how U.S. funding would help achieve price parity with dominant market competitors and expand access to next-generation devices. Priority consideration—consistent with applicable law—will be given to smartphone manufacturers headquartered in designated partner countries aligned with the Pax Silica framework.
Applicants will also be required to emphasize supply chain transparency and reliability. Participation in potential pilot programs designed to enhance traceability of critical components may be part of the evaluation process.
The State Department said the initiative represents a key component of broader U.S. efforts to support secure, autonomous, and resilient digital infrastructure among Indo-Pacific partners, as artificial intelligence and advanced mobile technologies become central to economic growth and regional connectivity.
